JPH085571Y2 - 光結合半導体装置 - Google Patents

光結合半導体装置

Info

Publication number
JPH085571Y2
JPH085571Y2 JP1988166725U JP16672588U JPH085571Y2 JP H085571 Y2 JPH085571 Y2 JP H085571Y2 JP 1988166725 U JP1988166725 U JP 1988166725U JP 16672588 U JP16672588 U JP 16672588U JP H085571 Y2 JPH085571 Y2 JP H085571Y2
Authority
JP
Japan
Prior art keywords
island
light emitting
emitting diode
terminal
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988166725U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0288258U (en]
Inventor
一哉 山越
伸一 谷迫
良樹 相原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988166725U priority Critical patent/JPH085571Y2/ja
Publication of JPH0288258U publication Critical patent/JPH0288258U/ja
Application granted granted Critical
Publication of JPH085571Y2 publication Critical patent/JPH085571Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
JP1988166725U 1988-12-24 1988-12-24 光結合半導体装置 Expired - Lifetime JPH085571Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988166725U JPH085571Y2 (ja) 1988-12-24 1988-12-24 光結合半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988166725U JPH085571Y2 (ja) 1988-12-24 1988-12-24 光結合半導体装置

Publications (2)

Publication Number Publication Date
JPH0288258U JPH0288258U (en]) 1990-07-12
JPH085571Y2 true JPH085571Y2 (ja) 1996-02-14

Family

ID=31454364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988166725U Expired - Lifetime JPH085571Y2 (ja) 1988-12-24 1988-12-24 光結合半導体装置

Country Status (1)

Country Link
JP (1) JPH085571Y2 (en])

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06837Y2 (ja) * 1987-04-27 1994-01-05 日本電気株式会社 固体素子リレ−
JP2511148Y2 (ja) * 1988-09-22 1996-09-18 シャープ株式会社 光結合素子

Also Published As

Publication number Publication date
JPH0288258U (en]) 1990-07-12

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